Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 1,700 employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.
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As a senior engineer in the Mechanical Engineering Division, you will be exposed to a broad range of technical challenges where you will apply your knowledge but also provide leadership and mentoring to teams and junior personnel. As the focal point at Draper for hardware development and fabrication, the staff within the Mechanical Engineering & System Packaging Division is responsible for supporting technical solutions across the Lab, connecting us to defense, space, energy, and biomechanical areas. Members of the division propose, design, analyze and build a variety of electro-mechanical hardware, ranging from precision instruments and micro-scale sensors, to robots and components for large, high-reliability systems.
We are seeking a candidate familiar with architecting, designing, and implementing electronics packaging solutions to complex problems. The candidate should be familiar with “traditional” packaging technologies such as surface-mount and wire-bonding (and the associated considerations for materials, process, etc.), but also be familiar with leading-edge technologies such as chip-stacking, system-in-package, and high-density substrates. Knowledge of connectors, their selection, and implementation is also critical. These experiences should be complimented by a solid understanding of mechanical and/or materials principals to help generate complete system solutions. A solid foundation and experience in state-of-the-art packaging for commercial/consumer electronics is desirable.
The technical responsibilities will vary depending on project needs, however example project topics include developing electronic packaging solutions for
The candidate may perform a range of tasks covering the entire design, analysis, prototyping, and testing cycle. In addition, the candidate will participate on cross-functional teams with engineers from other disciplines, clearly communicate design ideas and status updates to internal teams, and potentially meet with (and present to) external sponsors. It is also expected the candidate will take on responsibilities as soon as s/he joins and operate independently to provide immediate support to programs.
Tasks depend on program priorities, however desired skills include:
Master or Bachelor of Science degree in a relevant field such as mechanical engineering, materials science, manufacturing engineering, etc. Relevant project or work experience is required, Bachelors + 5 years experience, Masters + 3 years experience, minimum. Depending on the specific project assignment, the following skills are expected, though applicants are not required to have every skill listed:
Applicants selected will be subject to a government security investigation and must meet eligibility requirements for access to classified information.